Tile Calorimeter Phase I

Go to Phase II documentation

Fabrication and Assembly Details
Motherboard Section 1

1. PCB Specifications (B-2310V31B)
2. Cable assembly drawing
3. Schematics (6 sheets)
4. Component placement drawings
5. Component assembly list (xls)
6. Centroid list (xls)
7. Artwork for viewing (28 pdf pages, 14 films)

Pages	Film	Contents
1,2	1	Layer1, Top component layer (Signal_1)
3,4	2	Layer 2, Power plane (Vcc2=+15V)
5,6	3	Layer 3, Power plane(Vcc=+5V) (2 oz copper)
7,8	4	Layer 4, Power plane (Ground) (2 oz copper)
9,10	5	Layer 5, Inner signal layer (Signal_3)
11,12	6	Layer 6, Inner signal layer (Signal_4)
13,14	7	Layer 7, Power Plane (Vcc=-5V)
15,16	8	Layer 8, Bottom component layer (Signal_2)
17,18	9	Top solder mask
19,20	10	Bottom solder mask
21,22	11	Top silkscreen
23,24	12	Bottom silkscreen
25,26	13	Top paste mask
27,28	14	Bottom paste mask

8. Files for download to vendor:
• zip file 1 containing PCB specification file, schematics, component placement drawing, component assembly list, centroid list
• zip file 2 containing PCB specification file, Gerber and text files for PCB fabrication. Includes artwork of item 6 above plus aperture table, drill files and mill files.